algorithmic modeling for Rhino
Time: July 26, 2012 to July 27, 2012
Location: UCSF Mission Bay Conference Center
Street: 1675 Owens Street
City/Town: San Francisco
Website or Map: http://facade.archpaper.com/s…
Event Type: symposium
Organized By: The Architects Newspaper
Latest Activity: Jul 5, 2012
8 LU/HSW credits
Thursday, July 26th 2012 8:00 AM – 5:00 PM
UCSF Mission Bay Conference Center San Francisco, California
PRESENTERS PETER ARBOUR seele KEITH BOSWELL Skidmore Owings & Merrill MARK E. DANNETTEL Thornton Thomasetti LISA IWAMOTO IwamotoScott JASON KELLY JOHNSONFuture Cities Lab/California College of the Arts HAO KO Gensler BILL KREYSLER Kreysler & Associates ANDREW KUDLESS Matsys/California College of the Arts CHRIS LASCH Aranda\Lasch ARNOLD LEE HOK MIC PATTERSON Enclos, Corp. M. MIN RA Front GEOFF ROSSI Element DENNIS SHELDEN Gehry Technologies ANN SMITH Cambridge Architectural MARCELLO SPINAP-A-T-T-E-R-N-S SANJEEV TANKHA Buro Happold BEN TRANEL Gensler PHIL WILLIAMS Webcor Builders & Consulting Group
8 LU/HSW or 8 LU credits (depending upon workshop choice)
Friday, July 27th 2012 9:00 AM – 6:00 PM
California College of the Arts San Francisco, California
PARAMETRIC ENVELOPES WITH GRASSHOPPER
ANDREW KUDLESS Matsys Design/California College of the Arts
COMPOSITE FACADES IN ARCHITECTURE
BILL KREYSLER & JOSHUA ZABEL Kreysler & Associates
RESPONSIVE BUILDING FACADES
JASON KELLY JOHNSON Future Cities Lab/California College of the Arts
SCRIPTED FACADES
CHRIS LASCH Aranda/Lasch
PARAMETRIC FACADE TECTONICS
KEVIN MCCLELLAN & ANDREW VRANA Digital Fabrication Alliance
BIM MODELING WITH REVIT/INTRO TO VASARI
GERMAN APARICIO California College of the Arts & Autodesk Fellow
Presented by Enclos and The Architect’s Newspaper, COLLABORATION will bring together in a two-day event, the industry, the profession, and the academy to explore the evolution and the issues surrounding today’s high tech building envelope through case studies and lectures presented by foremost
Aimed at architects, building owners and developers, general contractors, engineers, fabricators, material suppliers, educators, and students, the event’s panels and sessions address the transformative opportunities created by new technologies and resources. From using BIM for communicating effectively with fabricators, to energy modeling, to retrofitting practices and the latest design tools, the COLLABORATION conference offers an unprecedented opportunity to survey the possibilities of designing in the digital age.
Who Should Attend
Architects, designers, engineers, building owners, developers, and facade consultants interested in gaining increased understanding of cutting-edge building envelope technologies.
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